- Patent Title: Integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom nickel-iron alloy shields having a low coefficient of thermal expansion
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Application No.: US14932775Application Date: 2015-11-04
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Publication No.: US09647205B2Publication Date: 2017-05-09
- Inventor: Scott Popelar , Matthew Von Thun , Richard Jadomski , Karen Jackson
- Applicant: Aeroflex Colorado Springs Inc.
- Applicant Address: US CO Colorado Springs
- Assignee: Aeroflex Colorado Springs Inc.
- Current Assignee: Aeroflex Colorado Springs Inc.
- Current Assignee Address: US CO Colorado Springs
- Agency: Hogan Lovells US LLP
- Agent Peter J. Meza
- Main IPC: H01L43/12
- IPC: H01L43/12 ; H01L23/552 ; H01L27/22 ; H01L23/10 ; H01L43/02
Abstract:
An integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom nickel-iron alloy shields having a low coefficient of thermal expansion of especial utility in conjunction with magnetoresistive random access memory (MRAM) and other devices requiring magnetic shielding.
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