Invention Grant
- Patent Title: Wafer-level flip chip device packages and related methods
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Application No.: US14952294Application Date: 2015-11-25
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Publication No.: US09647188B2Publication Date: 2017-05-09
- Inventor: Michael A. Tischler
- Applicant: Michael A. Tischler
- Applicant Address: CA Richmond, British Columbia
- Assignee: COOLEDGE LIGHTING INC.
- Current Assignee: COOLEDGE LIGHTING INC.
- Current Assignee Address: CA Richmond, British Columbia
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/62 ; H01L21/78 ; H01L33/50 ; H01L23/00 ; H01L23/544 ; H01L25/065 ; H01L21/683 ; H01L33/00
Abstract:
In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
Public/Granted literature
- US20160087179A1 WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS Public/Granted day:2016-03-24
Information query
IPC分类:
