Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US14441022Application Date: 2013-11-06
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Publication No.: US09647072B2Publication Date: 2017-05-09
- Inventor: Toru Hiyoshi , Takeyoshi Masuda , Keiji Wada , Takashi Tsuno
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; F. Brock Riggs
- Priority: JP2012-275754 20121218
- International Application: PCT/JP2013/079992 WO 20131106
- International Announcement: WO2014/097760 WO 20140626
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/66 ; H01L29/04 ; H01L29/423 ; H01L29/78 ; H01L21/3065 ; H01L21/04

Abstract:
A silicon carbide semiconductor device has a silicon carbide substrate, a gate insulating film, and a gate electrode. Silicon carbide substrate includes a first impurity region having a first conductivity type, a well region being in contact with the first impurity region and having a second conductivity type which is different from the first conductivity type, and a second impurity region separated from the first impurity region by the well region and having the first conductivity type. The gate insulating film is in contact with the first impurity region and the well region. The gate electrode is in contact with the gate insulating film and is arranged opposite to the well region with respect to the gate insulating film. A specific on-resistance at a voltage which is half a gate driving voltage applied to the gate electrode is smaller than twice the specific on-resistance at the gate driving voltage.
Public/Granted literature
- US20150303266A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2015-10-22
Information query
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