Invention Grant
- Patent Title: FINFET structures and methods of forming the same
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Application No.: US14739928Application Date: 2015-06-15
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Publication No.: US09647071B2Publication Date: 2017-05-09
- Inventor: Cheng-Yi Peng , Chih Chieh Yeh , Tsung-Lin Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/15 ; H01L29/10 ; H01L27/088 ; H01L29/66 ; H01L21/306

Abstract:
FinFETs and methods of forming finFETs are described. According to some embodiments, a structure includes a channel region, first and second source/drain regions, a dielectric layer, and a gate electrode. The channel region includes semiconductor layers above a substrate. Each of the semiconductor layers is separated from neighboring ones of the semiconductor layers, and each of the semiconductor layers has first and second sidewalls. The first and second sidewalls are aligned along a first and second plane, respectively, extending perpendicularly to the substrate. The first and second source/drain regions are disposed on opposite sides of the channel region. The semiconductor layers extend from the first source/drain region to the second source/drain region. The dielectric layer contacts the first and second sidewalls of the semiconductor layers, and the dielectric layer extends into a region between the first plane and the second plane. The gate electrode is over the dielectric layer.
Public/Granted literature
- US20160365414A1 FINFET Structures and Methods of Forming the Same Public/Granted day:2016-12-15
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