Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15260863Application Date: 2016-09-09
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Publication No.: US09647068B2Publication Date: 2017-05-09
- Inventor: Herb He Huang
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee Address: CN
- Agency: Innovation Counsel LLP
- Priority: CN201410032806 20140123
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/78 ; H01L29/66 ; H01L21/768 ; H01L29/786 ; H01L23/48 ; H01L29/06 ; H01L21/265

Abstract:
A semiconductor device includes a base dielectric layer, a semiconductor substrate layer disposed on the base dielectric layer, and a transistor disposed in the semiconductor substrate layer. The transistor includes a gate dielectric layer disposed on the semiconductor substrate layer, a gate electrode disposed on the gate dielectric layer, source and drain electrodes disposed within the semiconductor substrate layer on opposite sides of the gate electrode, an undoped channel region, a base dopant region, and a threshold voltage setting region. The undoped channel region, base dopant region, and threshold voltage setting region are disposed within the semiconductor substrate layer. The undoped channel region is disposed between the source electrode and the drain electrode, and the base dopant region and the threshold voltage setting region extend beneath the source electrode and the drain electrode. The threshold voltage setting region is disposed between the undoped channel region and the base dopant region.
Public/Granted literature
- US20160380057A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-12-29
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