Invention Grant
- Patent Title: Semiconductor device and related electronic device
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Application No.: US15098889Application Date: 2016-04-14
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Publication No.: US09647064B2Publication Date: 2017-05-09
- Inventor: Lei Zhong , Hongwei Li , Wei Lei , Huijuan Cheng
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee Address: CN
- Agency: Innovation Counsel LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/02
Abstract:
A semiconductor device may include the following elements: a first n-type region; a second n-type region; a p-type region, which directly contacts each of the first n-type region and the second n-type region; a first p-type portion, which directly contacts the first n-type region; a first n-type portion, which directly contacts each of the first n-type region and the p-type region; a first electrode, which is electrically connected to each of the first p-type portion and the first n-type portion; a second p-type portion, which directly contacts the second n-type region; a second n-type portion, which directly contacts each of the second n-type region and the p-type region; and a second electrode, which is electrically connected to each of the second p-type portion and the second n-type portion.
Public/Granted literature
- US20160307883A1 SEMICONDUCTOR DEVICE AND RELATED ELECTRONIC DEVICE Public/Granted day:2016-10-20
Information query
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