Invention Grant
- Patent Title: Heat dissipation device and semiconductor device
-
Application No.: US14414728Application Date: 2013-07-18
-
Publication No.: US09646915B2Publication Date: 2017-05-09
- Inventor: Yoshitaka Iwata , Shogo Mori , Daizo Kamiyama , Kenji Tsubokawa , Shinichi Soga , Hideo Tanimoto
- Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI , Kyocera Corporation
- Applicant Address: JP Kariya-shi
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kariya-shi
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-159734 20120718; JP2012-284011 20121227; JP2012-284012 20121227
- International Application: PCT/JP2013/069515 WO 20130718
- International Announcement: WO2014/014054 WO 20140123
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H01L23/467 ; H01L23/373 ; H01L23/00

Abstract:
In a laminating direction of first to fifth ceramic sheets, a first slit and a second slit are positioned closer to a first mounting section and a second mounting section than a first communication hole, a second communication hole, a third communication hole and a fourth communication hole. Moreover, an overlapping section where each first slit and the first communication hole overlap, and an overlapping section where each second slit and the third communication hole overlap, are positioned in the vicinity of an area where the first mounting section and the second mounting section are disposed when viewed from the laminating direction of the first to fifth ceramic sheets.
Public/Granted literature
- US20150221579A1 HEAT DISSIPATION DEVICE AND SEMICONDUCTOR DEVICE Public/Granted day:2015-08-06
Information query
IPC分类: