The embodiments described herein provide a die crack detector and method that use a conductive trace arranged to at least substantially extend around a perimeter of an integrated circuit die. A one-time programmable element, such as a fuse, is coupled in series with the conductive trace, and a package lead is electrically coupled to both the fuse and another operational element on the integrated circuit die. With the fuse intact the package lead can thus be used to determine a measurement of the conductivity of the conductive trace, with the measurement of conductivity indicative of the presence of a crack on the die. After such testing the fuse can be electrically opened, and the package lead used for normal operation of the device on the packaged die without the conductive trace interfering with this operation.