- Patent Title: High quality electrical contacts between integrated circuit chips
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Application No.: US15261343Application Date: 2016-09-09
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Publication No.: US09646882B2Publication Date: 2017-05-09
- Inventor: Huilong Zhu
- Applicant: Huilong Zhu
- Agency: Troutman Sanders LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/528 ; H01L21/66 ; H01L23/538 ; H01L25/00 ; H01L25/065 ; H01L23/532 ; H01L23/522 ; H01L23/48 ; H01L23/00
Abstract:
Methods and structures of connecting at least two integrated circuits in a 3D arrangement by a zigzag conductive chain are disclosed. The zigzag conductive chain, acting as a spring or self-adaptive contact structure (SACS) in a wafer bonding process, is designed to reduce bonding interface stress, to increase bonding interface reliability, and to have an adjustable height to close undesirable opens or voids between contacts of the two integrated circuits.
Public/Granted literature
- US20170062273A1 HIGH QUALITY ELECTRICAL CONTACTS BETWEEN INTEGRATED CIRCUIT CHIPS Public/Granted day:2017-03-02
Information query
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