- Patent Title: Substrate processing system and substrate transfer control method
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Application No.: US14055490Application Date: 2013-10-16
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Publication No.: US09646864B2Publication Date: 2017-05-09
- Inventor: Daisuke Morisawa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2012-232691 20121022
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67
Abstract:
A substrate processing system includes a plurality of processing chambers configured to perform a predetermined processing with respect to substrates, a transfer device configured to transfer the substrates to the processing chambers in a predetermined order, and a delivery unit configured to deliver the substrates between the delivery unit and the transfer device. The substrate processing system configured to sequentially process the substrates by repeating an operation in a predetermined transfer order. The substrate processing system includes a transfer order setting unit and a transfer control unit configured to switch the first transfer order to the second transfer order.
Public/Granted literature
- US20140112743A1 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE TRANSFER CONTROL METHOD Public/Granted day:2014-04-24
Information query
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