Invention Grant
- Patent Title: Low pressure encapsulant for size-reduced semiconductor package
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Application No.: US15236586Application Date: 2016-08-15
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Publication No.: US09646857B2Publication Date: 2017-05-09
- Inventor: Howard Terry Glascock , Frank Juskey , Thomas Scott Morris , Charles E. Carpenter , Robert Hartmann
- Applicant: Qorvo US, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; H01L25/065 ; H01L25/00 ; H01L23/31 ; H01L23/29
Abstract:
The present disclosure relates to a packaging process using a low pressure encapsulant. According to an exemplary process, an assembly including a substrate, a surface mounted device (SMD) mounted on the substrate, and a space between the SMD and the substrate is provided. The SMD has a sealed cavity biased towards the substrate. A sheet mold compound is laid over the SMD and the assembly is heated such that the sheet mold compound transitions to a liquid phase to form a molten mold compound. Next, the assembly is subjected to a vacuum that creates a negative atmosphere allowing the molten mold compound to flow towards the top surface of the substrate and about the SMD. The molten mold compound is then pressed towards the substrate at a low pressure (
Public/Granted literature
- US20170047232A1 LOW PRESSURE ENCAPSULANT FOR SIZE-REDUCED SEMICONDUCTOR PACKAGE Public/Granted day:2017-02-16
Information query
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