Invention Grant
- Patent Title: Wafer structure for electronic integrated circuit manufacturing
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Application No.: US15060142Application Date: 2016-03-03
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Publication No.: US09646835B2Publication Date: 2017-05-09
- Inventor: David B. Kerwin , Joseph M. Benedetto
- Applicant: Aeroflex Colorado Springs Inc.
- Applicant Address: US CO Colorado Springs
- Assignee: Aeroflex Colorado Springs Inc.
- Current Assignee: Aeroflex Colorado Springs Inc.
- Current Assignee Address: US CO Colorado Springs
- Agency: Hogan Lovells US LLP
- Agent Peter J. Meza
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/18 ; H01L27/092 ; H01L21/02 ; H01L21/304 ; H01L21/683 ; H01L29/10
Abstract:
A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits.
Public/Granted literature
- US20160260609A1 WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING Public/Granted day:2016-09-08
Information query
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