Invention Grant
- Patent Title: Sealing groove methods for semiconductor equipment
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Application No.: US14456146Application Date: 2014-08-11
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Publication No.: US09646807B2Publication Date: 2017-05-09
- Inventor: Dmitry Lubomirsky , Qiwei Liang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/00
- IPC: C23C16/00 ; B43M3/00 ; F16L39/00 ; F16L41/00 ; F16L45/00 ; F16L51/00 ; H01J37/32
Abstract:
In one embodiment, a surface having a sealing groove formed therein. The sealing groove is configured to accept an elastomeric seal. The sealing groove includes a first portion having a full dovetail profile and at least on a second portion having a half dovetail profile.
Public/Granted literature
- US20150047786A1 SEALING GROOVE METHODS FOR SEMICONDUCTOR EQUIPMENT Public/Granted day:2015-02-19
Information query
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