Invention Grant
- Patent Title: Offset bus connection with field shaping and heat sink
-
Application No.: US14658218Application Date: 2015-03-15
-
Publication No.: US09646793B2Publication Date: 2017-05-09
- Inventor: Jeffrey T. Jordan , Alan K. Shepherd , Edgar Avalos Ortiz
- Applicant: SCHNEIDER ELECTRIC USA, INC.
- Applicant Address: US MA Andover
- Assignee: Schneider Electric USA, Inc.
- Current Assignee: Schneider Electric USA, Inc.
- Current Assignee Address: US MA Andover
- Agency: Locke Lord LLP
- Main IPC: H01H71/10
- IPC: H01H71/10 ; H01H1/38 ; H01H9/52 ; H01R25/16 ; H01R4/60 ; H01H1/62 ; H01H33/02 ; H01H33/24

Abstract:
Method and apparatus for reducing the minimum clearance needed between an electrical conductor and ground in switchgear and similar electrical isolation equipment provide a bus-connector having an extended toroidal shape that is designed to allow the size of the switchgear cabinet to be reduced while complying with industry-standard performance requirements. The toroidal shaped bus-connector has mostly or only smooth and rounded surfaces so there are no hard or sharp edges or corners from which electrical discharge from/to ground or other conductors may occur. The shaped bus-connector also has an elongated body that produces an offset connection resembling a “Z,” which allows power buses and breaker terminals that do not vertically line up to connect.
Public/Granted literature
- US20160268086A1 OFFSET BUS CONNECTION WITH FIELD SHAPING AND HEAT SINK Public/Granted day:2016-09-15
Information query