Invention Grant
- Patent Title: Booster antenna, contactless chip arrangement, antenna structure and chip arrangement
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Application No.: US14192895Application Date: 2014-02-28
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Publication No.: US09646242B2Publication Date: 2017-05-09
- Inventor: Guenter Hofer , Gerald Holweg , Walther Pachler
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner mbB
- Priority: DE102013102051 20130301
- Main IPC: G06K19/077
- IPC: G06K19/077 ; H01Q7/00 ; H01Q1/22 ; H01Q1/38 ; H01Q9/20 ; H01Q9/42 ; H01Q21/30

Abstract:
In various embodiments, a booster antenna for a chip arrangement is provided. The booster antenna includes: a first circuit, which forms a first resonant circuit; a second circuit, which forms a second resonant circuit, wherein the first circuit is electrically conductively connected to the second circuit; and a third circuit, which forms a third resonant circuit, wherein the third circuit is electrically conductively connected to the second circuit.
Public/Granted literature
- US20140246503A1 BOOSTER ANTENNA, CONTACTLESS CHIP ARRANGEMENT, ANTENNA STRUCTURE AND CHIP ARRANGEMENT Public/Granted day:2014-09-04
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