A manufacturing method of an electronic component allows an intermediate inspection during a manufacturing process and includes forming element electrodes and feed lines such that pad portions of the element electrodes and the corresponding one of the feed lines faces each other via a gap in a plan view, and such that the feed lines are located below the pad portions 11b. Electrolytic plating is performed while power is supplied to the feed lines to form a plating film that electrically connects the feed lines and the pad portions. The mother substrate is singulated to obtain an electronic component.