Invention Grant
- Patent Title: Antifungal compound and uses thereof
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Application No.: US14095757Application Date: 2013-12-03
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Publication No.: US09642829B2Publication Date: 2017-05-09
- Inventor: Chaminda Jayampath Seneviratne , Yi Tsun Richard Kao , Lakshman Perera Samaranayake , Kwok Yung Yuen , Dan Yang , Yu Wang , Sze Wah Sarah Wong
- Applicant: The University of Hong Kong
- Applicant Address: CN Hong Kong
- Assignee: THE UNIVERSITY OF HONG KONG
- Current Assignee: THE UNIVERSITY OF HONG KONG
- Current Assignee Address: CN Hong Kong
- Agency: Leason Ellis LLP
- Main IPC: C07D309/34
- IPC: C07D309/34 ; A61K31/351 ; A01N43/40 ; A01N59/00 ; A61K9/00 ; A61K9/08

Abstract:
Disclosed herein is a novel antifungal compound, derivatives that are used to treat fungal infections. In a specific embodiment, the compound is a small molecule. In a specific embodiment, the compound described herein inhibits yeast to hypha transition under robust hyphal inducing conditions at lower concentration of the molecule. Also disclosed is a composition comprising the antifungal compound. In a specific embodiment, the composition is a pharmaceutical composition. Also disclosed is a method of treating and/or preventing fungal infection using the disclosed compound. The disclosed compound exhibits antifungal activity against wide range of fungal species at slightly higher concentrations. Antifungal compound disclosed herein is used as anti-biofilm agent against fungal infections.
Public/Granted literature
- US20140155478A1 ANTIFUNGAL COMPOUND AND USES THEREOF Public/Granted day:2014-06-05
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