A light-emitting device package including: a package substrate; first to fifth conductive patterns disposed on a top surface of the package substrate; a first rectifying circuit disposed on the first and second conductive patterns; a first light-emitting device disposed on the fifth conductive pattern and electrically connected to the first rectifying circuit; a second rectifying circuit disposed on the third and fourth conductive patterns; and a second light-emitting device disposed on the fifth conductive pattern and electrically connected to the second rectifying circuit.