Invention Grant
- Patent Title: Connection structure of crimp terminal with respect to wire
-
Application No.: US15007424Application Date: 2016-01-27
-
Publication No.: US09640877B2Publication Date: 2017-05-02
- Inventor: Hiroshi Aoki , Kazuto Ohtaka
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2013-174769 20130826; JP2013-174829 20130826; JP2013-174830 20130826; JP2014-057086 20140319; JP2014-077836 20140404
- Main IPC: H01R4/18
- IPC: H01R4/18 ; H01R4/62 ; H01R13/52

Abstract:
Herein disclosed is a connection structure including a waterproof sheet disposed in an inner surface of a wire connection section and has an opening section in a position corresponding to a conductor exposed section, in which the waterproof sheet is configured such that a front end of the waterproof sheet is positioned on a front side from a front end of a conductor crimp section and a rear end of the waterproof sheet is positioned on a rear side from a rear end of the cover crimp section.
Public/Granted literature
- US20160141768A1 CONNECTION STRUCTURE OF CRIMP TERMINAL WITH RESPECT TO WIRE Public/Granted day:2016-05-19
Information query