Invention Grant
- Patent Title: High performance high temperature thermoelectric composites with metallic inclusions
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Application No.: US14161641Application Date: 2014-01-22
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Publication No.: US09640746B2Publication Date: 2017-05-02
- Inventor: James M. Ma , Sabah K. Bux , Jean-Pierre Fleurial , Vilupanur A. Ravi , Samad A. Firdosy , Kurt Star , Richard B. Kaner
- Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY
- Applicant Address: US CA Pasadena
- Assignee: California Institute of Technology
- Current Assignee: California Institute of Technology
- Current Assignee Address: US CA Pasadena
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L35/26
- IPC: H01L35/26 ; H01L35/18 ; H01L35/16
Abstract:
The present invention provides a composite thermoelectric material. The composite thermoelectric material can include a semiconductor material comprising a rare earth metal. The atomic percent of the rare earth metal in the semiconductor material can be at least about 20%. The composite thermoelectric material can further include a metal forming metallic inclusions distributed throughout the semiconductor material. The present invention also provides a method of forming this composite thermoelectric material.
Public/Granted literature
- US20160111619A1 HIGH PERFORMANCE HIGH TEMPERATURE THERMOELECTRIC COMPOSITES WITH METALLIC INCLUSIONS Public/Granted day:2016-04-21
Information query
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