A wafer-level method of fabricating optoelectronic modules performing a first vacuum injection technique, using a first vacuum injection tool, to surround optoelectronic devices laterally with a transparent overmold region, performing a replication technique to form a respective passive optical element on a top surface of each overmold region, and performing a second vacuum injected technique to form sidewalls laterally surrounding and in contact with sides of each overmold region. The replication technique and the second vacuum injection technique are performed using a combined replication and vacuum injection tool.