Invention Grant
- Patent Title: Integrated circuit employing variable thickness film
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Application No.: US11781664Application Date: 2007-07-23
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Publication No.: US09640666B2Publication Date: 2017-05-02
- Inventor: Igor Peidous
- Applicant: Igor Peidous
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, Inc.
- Current Assignee: GLOBALFOUNDRIES, Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Farjami & Farjami LLP
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L29/786 ; H01L21/8238 ; H01L21/84 ; H01L27/12 ; H01L29/06 ; H01L29/66 ; H01L29/78
Abstract:
An integrated circuit that includes: providing a substrate including a support structure, a dielectric layer, and a variable thickness film processed to include the dielectric layer within a recess of the variable thickness film; forming a gate over the variable thickness film; and forming a channel and a source/drain within the variable thickness film.
Public/Granted literature
- US20090026545A1 INTEGRATED CIRCUIT EMPLOYING VARIABLE THICKNESS FILM Public/Granted day:2009-01-29
Information query
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