Invention Grant
- Patent Title: Embedded DRAM in replacement metal gate technology
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Application No.: US14527278Application Date: 2014-10-29
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Publication No.: US09640538B2Publication Date: 2017-05-02
- Inventor: Yanxiang Liu , Min-hwa Chi
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong & Steiner, P.C.
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; H01L27/108 ; H01L21/308

Abstract:
Methods for forming an eDRAM with replacement metal gate technology and the resulting device are disclosed. Embodiments include forming first and second dummy electrodes on a substrate, each dummy electrode having spacers at opposite sides and being surrounded by an ILD; removing the first and second dummy electrodes, forming first and second cavities, respectively; forming a hardmask over the substrate, exposing the first cavity; forming a deep trench in the substrate through the first cavity; removing the hardmask; and forming a capacitor in the first cavity and deep trench and concurrently forming an access transistor in the second cavity.
Public/Granted literature
- US20160126245A1 EMBEDDED DRAM IN REPLACEMENT METAL GATE TECHNOLOGY Public/Granted day:2016-05-05
Information query
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