Invention Grant
- Patent Title: Matrix lid heatspreader for flip chip package
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Application No.: US14850070Application Date: 2015-09-10
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Publication No.: US09640469B2Publication Date: 2017-05-02
- Inventor: George R. Leal , Tim V. Pham
- Applicant: George R. Leal , Tim V. Pham
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495 ; H01L23/433 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/367 ; H01L23/373 ; H01L23/498 ; H01L25/065
Abstract:
A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array (310) designed for direct attachment to an array of integrated circuit die (306) by including a thermal interface adhesion layer (308) to each die (306) and encapsulating the attached heat spreader lid array (310) and array of integrated circuit die (306) with mold compound (321) except for planar upper lid surfaces of the heat spreader lids (312).
Public/Granted literature
- US20160005682A1 Matrix Lid Heatspreader for Flip Chip Package Public/Granted day:2016-01-07
Information query
IPC分类:
