Invention Grant
- Patent Title: Automated inline inspection of wafer edge strain profiles using rapid photoreflectance spectroscopy
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Application No.: US14688739Application Date: 2015-04-16
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Publication No.: US09640449B2Publication Date: 2017-05-02
- Inventor: Timothy Goodwin , Lena Nicolaides , Mohan Mahadevan , Paul Horn , Shifang Li
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01N21/88
- IPC: G01N21/88 ; G01N21/95 ; H01L21/66 ; G01B11/16
Abstract:
Photoreflectance spectroscopy is used to measure strain at or near the edge of a wafer in a production process. The strain measurement is used to anticipate defects and make prospective corrections in later stages of the production process. Strain measurements are used to associate various production steps with defects to enhance later production processes.
Public/Granted literature
- US20150371910A1 Automated Inline Inspection of Wafer Edge Strain Profiles Using Rapid Photoreflectance Spectroscopy Public/Granted day:2015-12-24
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