Invention Grant
- Patent Title: Test circuit and method
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Application No.: US14186107Application Date: 2014-02-21
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Publication No.: US09640447B2Publication Date: 2017-05-02
- Inventor: Mill-Jer Wang , Ching-Nen Peng , Hung-Chih Lin , Hao Chen , Chung-Han Huang
- Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R31/26 ; H01L21/66 ; G01R31/28

Abstract:
A circuit is disclosed that includes a signal-forcing path, a discharging path, a contact probe, a monitoring probe and a switch module. The signal-forcing path is connected to a signal source. The discharging path is connected to a discharging voltage terminal. The contact probe contacts a pad module of an under-test device. The monitoring probe generates a monitored voltage associated with the pad module. The switch module is operated in a discharging mode to connect the contact probe to the discharging path when the monitored voltage does not reach a threshold voltage such that the under-test device is discharged and is operated in an operation mode to connect the contact probe to the signal-forcing path when the monitored voltage reaches the threshold voltage such that a signal generated by the signal source is forced to the under-test device.
Public/Granted literature
- US20150241508A1 Test Circuit And Method Public/Granted day:2015-08-27
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