Invention Grant
- Patent Title: Apparatus and method for enhancing the cool down of radiatively heated substrates
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Application No.: US12622736Application Date: 2009-11-20
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Publication No.: US09640412B2Publication Date: 2017-05-02
- Inventor: Wolfgang Aderhold , Joseph M. Ranish , Blake R. Koelmel
- Applicant: Wolfgang Aderhold , Joseph M. Ranish , Blake R. Koelmel
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: A21B2/00
- IPC: A21B2/00 ; H01L21/324 ; H01L21/67
Abstract:
The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a dynamic heat sink that is substantially transparent to light from a radiant heat source, the dynamic heat sink being positioned near the substrate so the two are coupled. Additional embodiments of the invention are directed to methods of processing a substrate using the apparatuses described.
Public/Granted literature
- US20110123178A1 Apparatus and Method for Enhancing the Cool Down of Radiatively Heated Substrates Public/Granted day:2011-05-26
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