Invention Grant
- Patent Title: Polishing composition
-
Application No.: US14123889Application Date: 2012-05-31
-
Publication No.: US09640407B2Publication Date: 2017-05-02
- Inventor: Yasuyuki Yamato , Youhei Takahashi , Tomohiko Akatsuka
- Applicant: Yasuyuki Yamato , Youhei Takahashi , Tomohiko Akatsuka
- Applicant Address: JP Kiyosu-Shi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2011-132412 20110614; JP2011-132413 20110614; JP2011-284285 20111226; JP2011-284286 20111226
- International Application: PCT/JP2012/064046 WO 20120531
- International Announcement: WO2012/172983 WO 20121220
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/3105 ; H01L21/321 ; C09K3/14 ; C09G1/02
Abstract:
A polishing composition of the present invention contains a water-soluble polymer having a hydrophilic group, and abrasive grains. A hydrophobic silicon-containing part after being polished with the polishing composition has a water contact angle lower than that of the hydrophobic silicon-containing part after being polished with another composition having the same makeup as the polishing composition except that the water-soluble polymer is not contained therein. Examples of the water-soluble polymer include polysaccharides and alcohol compounds. Another polishing composition of the present invention contains abrasive grains having a silanol group, and a water-soluble polymer. When this polishing composition is left to stand for one day in an environment at a temperature of 25° C., the water-soluble polymer is adsorbed on the abrasive grains at 5,000 or more molecules per 1 μm2 of surface area of the abrasive grains. Examples of this water-soluble polymer include nonionic compounds having a polyoxyalkylene chain.
Public/Granted literature
- US20140094033A1 POLISHING COMPOSITION Public/Granted day:2014-04-03
Information query
IPC分类:
