Invention Grant
- Patent Title: Multilayer inductor and power supply circuit module
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Application No.: US14255080Application Date: 2014-04-17
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Publication No.: US09640313B2Publication Date: 2017-05-02
- Inventor: Hirokazu Yazaki
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2012-042659 20120229
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/02 ; H01F27/29 ; H01F17/00

Abstract:
A multilayer inductor includes a multilayer body formed by stacking magnetic layers on top of one another. Loop-like line-shaped conductors are respectively formed on the magnetic layers. The loop-like line-shaped conductors are connected to one another by interlayer connection conductors, and thereby a coil conductor having an axis extending in the stacking direction is formed. One end of the line-shaped conductor, which is an uppermost-layer-side end portion of the coil conductor, is connected to a line-shaped conductor, which is for routing and is formed on a higher layer, by a interlayer connection conductor. The line-shaped conductor is connected to an interlayer connection conductor that is formed so as to penetrate through substantially the center inside the loop-like line-shaped conductors. The interlayer connection conductor is connected to an external connection conductor on a bottom surface of the multilayer body via a line-shaped conductor and an interlayer connection conductor.
Public/Granted literature
- US20140225702A1 MULTILAYER INDUCTOR AND POWER SUPPLY CIRCUIT MODULE Public/Granted day:2014-08-14
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