Invention Grant
- Patent Title: Semiconductor device including stacked semiconductor chips
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Application No.: US14727108Application Date: 2015-06-01
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Publication No.: US09640243B2Publication Date: 2017-05-02
- Inventor: Kayoko Shibata , Hiroaki Ikeda
- Applicant: PS4 Luxco S.a.r.l.
- Applicant Address: LU Luxembourg
- Assignee: Longitude Semiconductor S.a.r.l.
- Current Assignee: Longitude Semiconductor S.a.r.l.
- Current Assignee Address: LU Luxembourg
- Priority: JP2005-136659 20050509
- Main IPC: G11C11/407
- IPC: G11C11/407 ; H01L23/544 ; H01L23/535 ; H01L23/522 ; H01L25/065
Abstract:
A method is disclosed for selecting a semiconductor chip in a stack of semiconductor chips interconnected by through-lines by receiving selection signals at the first terminals located on a first surface of the semiconductor chip, connecting each first terminal to a selected second terminal located on a second surface of the semiconductor chip where each selected second terminal is not aligned with the first terminal to which it is connected, and generating an internal signal based on a selected one of the received selection signals.
Public/Granted literature
- US20150262645A1 Semiconductor Device Including Stacked Semiconductor Chips Public/Granted day:2015-09-17
Information query
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