Invention Grant
- Patent Title: Ring protocol for low latency interconnect switch
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Application No.: US13994792Application Date: 2011-11-29
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Publication No.: US09639490B2Publication Date: 2017-05-02
- Inventor: Robert G. Blankenship , Geeyarpuram N. Santhanakrishnan , Yen-Cheng Liu , Bahaa Fahim , Ganapati N. Srinivasa
- Applicant: Robert G. Blankenship , Geeyarpuram N. Santhanakrishnan , Yen-Cheng Liu , Bahaa Fahim , Ganapati N. Srinivasa
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Law Office of R. Alan Burnett, P.S
- International Application: PCT/US2011/062311 WO 20111129
- International Announcement: WO2013/081579 WO 20130606
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F13/40 ; G06F13/16 ; G06F17/13 ; G06F17/50

Abstract:
Methods, systems, and apparatus for implementing low latency interconnect switches between CPU's and associated protocols. CPU's are configured to be installed on a main board including multiple CPU sockets linked in communication via CPU socket-to-socket interconnect links forming a CPU socket-to-socket ring interconnect. The CPU's are also configured to transfer data between one another by sending data via the CPU socket-to-socket interconnects. Data may be transferred using a packetized protocol, such as QPI, and the CPU's may also be configured to support coherent memory transactions across CPU's.
Public/Granted literature
- US20150269104A1 RING PROTOCOL FOR LOW LATENCY INTERCONNECT SWITCH Public/Granted day:2015-09-24
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