Invention Grant
- Patent Title: System and method for providing settlement information
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Application No.: US14010045Application Date: 2013-08-26
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Publication No.: US09639405B2Publication Date: 2017-05-02
- Inventor: Jae-woo Ko , Tae-hwan Wi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwong-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwong-Si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0093292 20120824
- Main IPC: G06F9/54
- IPC: G06F9/54 ; G06Q30/04 ; G06Q30/06 ; G06Q30/02

Abstract:
A method for providing settlement information in which a device provides settlement information to an application which is installed on the device includes executing a first application which is installed on the device, receiving settlement information from an external device via the executed first application, converting at least a part of the received settlement information, and providing the converted settlement information to a second application which is installed on the device in order to allow the second application to use the received settlement information.
Public/Granted literature
- US20140059565A1 SYSTEM AND METHOD FOR PROVIDING SETTLEMENT INFORMATION Public/Granted day:2014-02-27
Information query