- Patent Title: Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
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Application No.: US14766433Application Date: 2014-02-03
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Publication No.: US09637598B2Publication Date: 2017-05-02
- Inventor: Hiroaki Fujiwara , Yuki Kitai , Hirosuke Saito
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2013-023572 20130208
- International Application: PCT/JP2014/000549 WO 20140203
- International Announcement: WO2014/122911 WO 20140814
- Main IPC: C08L61/04
- IPC: C08L61/04 ; C08G73/22 ; C08J5/24 ; H01L23/29 ; H01L23/14 ; C08G73/02 ; C08K5/378 ; C08L79/04 ; H05K1/03 ; B32B15/14 ; C08L63/00 ; C08G14/06 ; C08L61/34 ; B32B15/08 ; B32B15/092 ; B32B27/04
Abstract:
A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured.
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