Invention Grant
- Patent Title: Parison supply device and supply method
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Application No.: US14781461Application Date: 2014-04-23
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Publication No.: US09636865B2Publication Date: 2017-05-02
- Inventor: Norihisa Hirota , Ikuo Komatsu , Hiromitsu Fukuoka , Atsushi Yoneda , Kouichi Narutaki
- Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Applicant Address: JP Tokyo
- Assignee: Toyo Seikan Group Holdings, Ltd.
- Current Assignee: Toyo Seikan Group Holdings, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2013-091829 20130424
- International Application: PCT/JP2014/061374 WO 20140423
- International Announcement: WO2014/175311 WO 20141030
- Main IPC: B29C49/04
- IPC: B29C49/04 ; B29C49/30 ; B29C49/42 ; B29K105/00

Abstract:
A parison supply device that continuously supplies, to a blow molding die, parison sections of a parison discharged from an extrusion die, the parison section having a specified length. The parison supply device includes a plurality of tension chucks and a tension chuck operation unit that operates the plurality of tension chucks. The tension chuck operation unit causes the individual tension chucks to perform a repeated operation of grasping the parison at a first position near the extrusion die and moving to a second position separated from the extrusion die such that, before the preceding tension chuck is separated by a set distance from the extrusion die at the second position, the following tension chuck grasps the parison at the first position, and then the parison section is supplied to the blow molding die.
Public/Granted literature
- US20160039139A1 PARISON SUPPLY DEVICE AND SUPPLY METHOD Public/Granted day:2016-02-11
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