A punch (2) and a pad (5) are opposed to each other such that a molded portion (3a) of a metal laminate film (3) to be processed is interposed between the punch (2) and the pad (5). An enclosed space (6, 7) is compressed to raise only the temperature of the molded portion (3a) while keeping the vicinity of the molded portion (3a) at a low temperature (S1, S2). After that, the enclosed space (6, 7) is moved with respect to the molded portion (3a) to perform first molding (S3) on the molded portion (3a), and then gas in the enclosed space (6) is released to perform second molding (S4) on the molded portion (3a) by means of the punch (2) and the pad (5).