An electrical connector for connecting a chip module, includes an insulating body, multiple conducting terminals received in the insulating body, and a fixing member having a base for fixing the chip module. The insulating body has an accommodating cavity that is rectangular and opened upward. A stop wall projects upward from each of four corners of the accommodating cavity. Each conducting terminal has a contact portion extending upward for electrically contacting a conductive connection surface of the chip module. The contact portions are located in the accommodating cavity and do not exceed the stop wall upward. The base is assembled above the insulating body. Four extending portions extend downward from the base and are assembled at an outer side of the stop walls. An inner side of each extending portion is provided with a guiding inclined surface cooperating with the outer side of the stop wall.