Invention Grant
- Patent Title: Electronic device and method for fabricating the same
- Patent Title (中): 电子器件及其制造方法
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Application No.: US14212814Application Date: 2014-03-14
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Publication No.: US09590171B2Publication Date: 2017-03-07
- Inventor: Jin-Ho Lee , Ki-Seon Park
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-Si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-Si
- Agency: Perkins Coie LLP
- Priority: KR10-2013-0027839 20130315
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L43/08 ; H01L27/22

Abstract:
An electronic device in accordance with this technology includes semiconductor memory. The semiconductor memory may include a magnetization-pinned layer configured to include a first magnetic layer, a second magnetic layer, and a non-magnetic layer interposed between the first magnetic layer and the second magnetic layer, a free magnetization layer spaced apart from the magnetization-pinned layer, a tunnel barrier layer interposed between the magnetization-pinned layer and the free magnetization layer, and a magnetic spacer configured to come in contact with a side of the first magnetic layer and at least part of a side of the second magnetic layer.
Public/Granted literature
- US20140281231A1 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2014-09-18
Information query
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