Invention Grant
- Patent Title: Encapsulated piezoelectric valve
- Patent Title (中): 封装压电阀
-
Application No.: US14211563Application Date: 2014-03-14
-
Publication No.: US09590164B2Publication Date: 2017-03-07
- Inventor: Yufeng Qi
- Applicant: Parker-Hannifin Corporation
- Applicant Address: US OH Cleveland
- Assignee: Parker-Hannifin Corporation
- Current Assignee: Parker-Hannifin Corporation
- Current Assignee Address: US OH Cleveland
- Agency: Renner, Otto, Boisselle & Sklar, LLP.
- Main IPC: H01L41/04
- IPC: H01L41/04 ; H01L41/053 ; F16K31/00 ; H01L41/09 ; H01L41/22
Abstract:
An actuator assembly includes a housing and an actuator arranged within the housing, the actuator including a first part and a second part movable relative to the first part. An insulating material is disposed within the housing, the insulating material encapsulating at least the movable part of the actuator.
Public/Granted literature
- US20140325808A1 ENCAPSULATED PIEZOELECTRIC VALVE Public/Granted day:2014-11-06
Information query
IPC分类:
