Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14164853Application Date: 2014-01-27
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Publication No.: US09590075B2Publication Date: 2017-03-07
- Inventor: Mohamed N. Darwish
- Applicant: MaxPower Semiconductor, Inc.
- Applicant Address: US CA San Jose
- Assignee: MaxPower Semiconductor, Inc.
- Current Assignee: MaxPower Semiconductor, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Groover & Associates PLLC
- Agent Robert O. Groover, III; Gwendolyn G. Corcoran
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/40 ; H01L29/78 ; H01L21/20 ; H01L21/28 ; H01L21/02 ; H01L21/306 ; H01L21/324 ; H01L21/762 ; H01L21/265 ; H01L21/8238 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/423

Abstract:
A semiconductor device includes a semiconductor layer of a first conductivity type and a semiconductor layer of a second conductivity type formed thereon. The semiconductor device also includes a body layer extending a first predetermined distance into the semiconductor layer of the second conductivity type and a pair of trenches extending a second predetermined distance into the semiconductor layer of the second conductivity type. Each of the pair of trenches consists essentially of a dielectric material disposed therein and a concentration of doping impurities present in the semiconductor layer of the second conductivity type and a distance between the pair of trenches define an electrical characteristic of the semiconductor device. The semiconductor device further includes a control gate coupled to the semiconductor layer of the second conductivity type and a source region coupled to the semiconductor layer of the second conductivity type.
Public/Granted literature
- US20140203354A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-07-24
Information query
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