Invention Grant
- Patent Title: Passive devices for integration with three-dimensional memory devices
- Patent Title (中): 用于与三维存储器件集成的无源器件
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Application No.: US14739354Application Date: 2015-06-15
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Publication No.: US09589981B2Publication Date: 2017-03-07
- Inventor: Masatoshi Nishikawa , Ryoichi Honma , Toru Miwa , Hiroaki Koketsu , Johann Alsmeier
- Applicant: SanDisk Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Plano
- Agency: The Marbury Law Group PLLC
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L23/522 ; H01L23/528 ; H01L49/02 ; H01L21/265 ; H01L21/768 ; H01L21/3205
Abstract:
A three dimensional memory device includes a memory device region containing a plurality of non-volatile memory devices, a peripheral device region containing active driver circuit devices, and a stepped surface region between the peripheral device region and the memory device region containing a plurality of passive driver circuit devices.
Public/Granted literature
- US20160365352A1 PASSIVE DEVICES FOR INTEGRATION WITH THREE-DIMENSIONAL MEMORY DEVICES Public/Granted day:2016-12-15
Information query
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