Invention Grant
US09589938B2 Semiconductor device including an embedded surface mount device and method of forming the same
有权
包括嵌入式表面安装器件的半导体器件及其形成方法
- Patent Title: Semiconductor device including an embedded surface mount device and method of forming the same
- Patent Title (中): 包括嵌入式表面安装器件的半导体器件及其形成方法
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Application No.: US14981171Application Date: 2015-12-28
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Publication No.: US09589938B2Publication Date: 2017-03-07
- Inventor: Hsien-Wei Chen , Ying-Ju Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/48 ; H01L25/065 ; H01L23/31 ; H01L23/538 ; H01L23/12 ; H01L25/10 ; H01L25/00 ; H01L23/13 ; H01L23/498 ; H01L21/56 ; H01L23/50
Abstract:
Embodiments of the present disclosure include devices and methods of forming the same. An embodiment is a device including a solder resist coating over a first side of a substrate, an active surface of a die bonded to the first side of the substrate by a first connector, and a surface mount device mounted to the die by a second set of connectors, the surface mount device being between the die and the first side of the substrate, the surface mount device being spaced from the solder resist coating.
Public/Granted literature
- US20160133606A1 SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SURFACE MOUNT DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2016-05-12
Information query
IPC分类:
