In one semiconductor device, a semiconductor chip has first and second pad electrodes disposed on the main surface thereof, insulating films that cover the main surface of the semiconductor chip, a rewiring layer that is disposed between the insulating films, and a plurality of external terminals disposed on the top of the insulating film. The plane size of the first pad electrode and the second pad electrode differ from one another, and the first pad electrode and the second pad electrode are connected to any of the plurality of external terminals via the rewiring layer.