Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US14937935Application Date: 2015-11-11
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Publication No.: US09589878B2Publication Date: 2017-03-07
- Inventor: Sung Wuk Ryu , Dong Sun Kim , Hyun Seok Seo , Ji Haeng Lee
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: LRK Patent Law Firm
- Priority: KR10-2014-0156347 20141111
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/10 ; H01L25/00 ; H01L23/00
Abstract:
A semiconductor package includes: an upper package to which an element is mounted, and which includes a metal pad portion; a metal post connected to the metal pad portion; and a lower package to which an element is mounted, and which is connected to the metal post.
Public/Granted literature
- US20160133604A1 SEMICONDUCTOR PACKAGE Public/Granted day:2016-05-12
Information query
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