Invention Grant
US09589769B2 Apparatus and method for efficient materials use during substrate processing
有权
衬底加工过程中高效材料使用的装置和方法
- Patent Title: Apparatus and method for efficient materials use during substrate processing
- Patent Title (中): 衬底加工过程中高效材料使用的装置和方法
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Application No.: US14464175Application Date: 2014-08-20
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Publication No.: US09589769B2Publication Date: 2017-03-07
- Inventor: Vijayakumar C. Venugopal , Richard J. Hertel , Vikram Singh , Ernest E. Allen
- Applicant: Varian Semiconductor Equipment Associates, Inc.
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Main IPC: C23C14/00
- IPC: C23C14/00 ; H01J37/32
Abstract:
A processing apparatus may include a plasma chamber to house a plasma; and an extraction assembly disposed along a side of the plasma chamber. The extraction assembly may be configured to direct ions from the plasma to a substrate, wherein the ions generate etched species comprising material that is etched from the substrate; and wherein the extraction assembly comprises at least one component having a recess that faces the substrate and is configured to intercept and retain the etched species.
Public/Granted literature
- US20160013030A1 APPARATUS AND METHOD FOR EFFICIENT MATERIALS USE DURING SUBSTRATE PROCESSING Public/Granted day:2016-01-14
Information query
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