The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesives comprise at least one resin component, micron-sized electrically conductive particles having an average particle size of 2 μm to 50 μm, and from 0.01 to 15 wt. % of sub-micron-sized electrically conductive particles having a average particle size of 300 nm to 900 nm.