Invention Grant
- Patent Title: MRAM with magnetic material surrounding contact plug
- Patent Title (中): MRAM与磁性材料围绕接触塞
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Application No.: US15144738Application Date: 2016-05-02
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Publication No.: US09589617B2Publication Date: 2017-03-07
- Inventor: Ji-Ho Park
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-Si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-Si
- Agency: Perkins Coie LLP
- Priority: KR10-2014-0028754 20140312
- Main IPC: G11C11/16
- IPC: G11C11/16 ; G06F12/08 ; G06F13/40

Abstract:
This technology provides an electronic device and a method of fabricating the same. An electronic device in accordance with an implementation of this document includes semiconductor memory, and the semiconductor memory includes a contact plug which is disposed over a substrate and extends in a vertical direction; a variable resistance element which is coupled to the contact plug and includes a first magnetic layer having a variable magnetization direction, a second magnetic layer having a pinned magnetization direction, and a tunnel barrier layer interposed between the first magnetic layer and the second magnetic layer; and a third magnetic layer which surrounds a sidewall of the contact plug and has a same magnetization direction as the second magnetic layer.
Public/Granted literature
- US20160267956A1 MRAM WITH MAGNETIC MATERIAL SURROUNDING CONTACT PLUG Public/Granted day:2016-09-15
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