Invention Grant
- Patent Title: Method and apparatus for replicating the punch command
- Patent Title (中): 复制打孔指令的方法和装置
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Application No.: US14665110Application Date: 2015-03-23
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Publication No.: US09588703B1Publication Date: 2017-03-07
- Inventor: Assaf Natanzon , Saar Cohen , Lev Ayzenberg , Ariel Kulik
- Applicant: EMC Corporation
- Applicant Address: US MA Hopkinton
- Assignee: EMC IP Holding Company LLC
- Current Assignee: EMC IP Holding Company LLC
- Current Assignee Address: US MA Hopkinton
- Agent Krishnendu Gupta; Robert Kevin Perkins; Andre Gibbs
- Main IPC: G06F17/30
- IPC: G06F17/30 ; G06F3/06

Abstract:
The punch command may be replicated in a replication environment including a production site and a replication site. The solution includes implementing a punch command to free storage received at a replication site in a replication environment by applying the punch command to storage at the replication site and writing data being freed from the storage at the replication site to an undo stream of a journal at the replication site. If the punch command is not supported, a command to write zeros may be used. Further, an unpunch command is provided for properly undoing a punch command and storing data written to the volume before the punch command freed the storage. Additionally, large punch commands may be split into a plurality to smaller punch commands for efficient journal management. Additionally, volume space may be reclaimed by writing a punch command to the journal instead of zeros.
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