Invention Grant
- Patent Title: Attaching electrical components using non-conductive adhesive
- Patent Title (中): 使用非导电粘合剂安装电气元件
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Application No.: US14024374Application Date: 2013-09-11
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Publication No.: US09588552B2Publication Date: 2017-03-07
- Inventor: Yenyu Hsieh , Samuel W. Sheng , Shih-Ming Shih , Robert G. Nelson
- Applicant: Sentons Inc.
- Applicant Address: KY
- Assignee: Sentons Inc.
- Current Assignee: Sentons Inc.
- Current Assignee Address: KY
- Agency: Van Pelt, Yi & James LLP
- Main IPC: G02F1/1335
- IPC: G02F1/1335 ; G06F1/16 ; G06F3/041 ; G06F3/043
Abstract:
A touch input device is disclosed. The touch input device includes a touch input medium configured to receive a touch input. The touch input device includes a conductive trace coupled to the touch input medium. The touch input device also includes a transducer electrically coupled to the conductive trace and coupled to the touch input medium via a non-conductive adhesive.
Public/Granted literature
- US20150070597A1 ATTACHING ELECTRICAL COMPONENTS Public/Granted day:2015-03-12
Information query
IPC分类:
