Invention Grant
- Patent Title: Cooling device for use in space environment
- Patent Title (中): 用于空间环境的冷却装置
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Application No.: US13803513Application Date: 2013-03-14
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Publication No.: US09586703B2Publication Date: 2017-03-07
- Inventor: Tatsuya Sato , Ryoichi Kanazawa
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2012-080055 20120330
- Main IPC: F28C1/00
- IPC: F28C1/00 ; B64G1/50 ; F24F5/00 ; F25B19/00 ; F25B39/02 ; F28F3/04 ; F28F13/00 ; F28D7/10 ; F28D21/00 ; F28F1/06 ; F28F1/08 ; F24F6/04 ; B64G6/00

Abstract:
A space-environment dedicated cooling device includes a first flow path to which coolant to be cooled is fed, a second flow path thermally coupled to the first flow path and a water absorbing body which is exposed to the space environment when the cooling device is used in the space environment. The second flow path is fed with feedwater. The water absorbing body is fed with the feedwater from the second flow path. The water absorbing body includes a water absorbing member made of water-absorbing material.
Public/Granted literature
- US20130255303A1 COOLING DEVICE FOR USE IN SPACE ENVIRONMENT Public/Granted day:2013-10-03
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