Invention Grant
- Patent Title: Method of injection sealing gel into a recess of a work piece
- Patent Title (中): 将凝胶注入工件的凹槽中的方法
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Application No.: US14337747Application Date: 2014-07-22
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Publication No.: US09586342B2Publication Date: 2017-03-07
- Inventor: Robert Neil Shaddock , Fengchun Xie , Dandan Zhang , Lvhai Hu
- Applicant: Tyco Electronics (Shanghai) Co. Ltd. , Tyco Electronics Corporation
- Applicant Address: CN Shanghai US PA Berwyn
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.,Tyco Electronics Corporation
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.,Tyco Electronics Corporation
- Current Assignee Address: CN Shanghai US PA Berwyn
- Agency: Barley Snyder
- Priority: CN201310308368 20130722
- Main IPC: B29C31/04
- IPC: B29C31/04 ; B29C39/40 ; F16J15/32 ; B29D99/00 ; B29C39/02 ; F16J15/14 ; B29C37/00

Abstract:
A method of injecting a sealing gel into a recess of a work piece, comprising steps of: injecting the sealing gel into the recess and stopping the injection of the sealing gel when the sealing gel reaches a first depth less than the total depth of the recess; after the sealing gel has cooled and solidified, continuing the injection of the sealing gel into the recess and stopping the injection of the sealing gel when the sealing gel reaches another depth higher than the first depth; and repeatedly performing the previous step until the cooled and solidified sealing gel in the recess has a top surface beyond a sealing interface surface of the work piece.
Public/Granted literature
- US20150021825A1 Method of Injection Sealing Gel Into a Recess of a Work Piece Public/Granted day:2015-01-22
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